Russia’s semiconductor industry has made a significant advancement by developing its first domestically produced lithography machine. This announcement was made by the Zelenograd Nanotechnology Center (ZNTC), which has successfully constructed a lithography machine capable of operating at 350 nm technology.
This new device, termed a “350 nm resolution combined and illuminated device,” was developed in collaboration with the Belarusian company OJSC Planar. It has received approval from the Russian State Commission and is currently being adapted for the technical processes required by its end users. Additionally, contracts for the production of serial units are being established.
The lithography machine boasts several improvements, including an expanded working area, which has increased from 3.2 x 3.2 mm to 22 x 22 mm, and a maximum processed sheet diameter that has grown from 150 mm to 200 mm. Notably, it utilizes a solid-state laser as a radiation source, replacing the traditional mercury lamp, thereby enhancing efficiency and reducing energy consumption.
While the 350 nm chipmaking technology is considered outdated by global standards, it remains applicable for a variety of sectors, such as power electronics, the automotive industry, and defense. ZNTC has plans to further develop next-generation lithography technologies to manufacture 130 nm chips, catering to the needs of companies like Angstrom and Mikron, which produce components ranging from 250 nm to 90 nm.
The Russian government aims to complete the development of lithography machines for manufacturing chips at the 130 nm scale by 2026. Following that, the plan includes advancing to 28 nm technology by 2027 and 14 nm by 2030. However, challenges persist, as domestic equipment manufacturers reportedly face difficulties in adhering to this timeline.